IC package types

IC package - Normal IC package

Dual in-line (DIP) package - Terminals are on two opposite sides of the package and are arranged two rows.Lead pitch = 2.54 mm

Surface mount packages - Terminals are on four sides of the packageand are formed gull wing shape(L-shape).Lead potch = 1.0 mm,0.8 mm,0.65 mm

Pin grid array package - Terminals are on one surfaceof the of the package and are arrangedin a grid array.Lead pitch = 2.54mm, 1.27mm

Ball grid array package - Balls are on one surface of the packageand are arranged in a grid arrayTerminal pitch=1.0mm or more.

Chip scale package - Current design